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$800以上 (7)

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2022~2023 (1)
2020~2021 (2)
2016年以前 (4)

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精裝 (5)

作者


C. P. Wong (Ching-Ping)(EDI) (1)
C. P. Wong(EDI) (1)
Daniel Lu (EDT)/ C. P. Wong (EDT) (1)
Edited by Paul R. Besser 、Andrew J. McKerrow 、Francsca Iacopi 、C. P. Wong 、Joost J. Vlassak (1)
Grotta, James C.,Albers, Gregory W, MD, Professor,Broderick, Joseph P, MD,Kasner, Scott E, MD, MSCE, FRCP,Lo, Eng H.,Sacco, Ralph L, MD MS FAHA FAAN,Wong, Lawrence KS, MD, FRCP,Day, Arthur L. (1)
T. Endo (EDT)/ P. H. Seeberger (EDT)/ G. W. Hart (EDT)/ C. H. Wong (EDT)/ N. Taniguchi (EDT) (1)
Yi Li/ Daniel Lu/ C. P. Wong (1)

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Springer Verlag (3)
Springer Nature (2)
CAMBRIDGE UNIVERSITY PRESS (1)
Elsevier - Health Sciences Division (1)

三民網路書店 / 搜尋結果

7筆商品,1/1頁
Nano-Bio- Electronic, Photonic and Mems Packaging

1.Nano-Bio- Electronic, Photonic and Mems Packaging

作者:C. P. Wong(EDI)  出版社:Springer Nature  出版日:2021/04/26 裝訂:精裝
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Materials for Advanced Packaging

2.Materials for Advanced Packaging

作者:Daniel Lu (EDT); C. P. Wong (EDT)  出版社:Springer Verlag  出版日:2008/11/01 裝訂:精裝
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a c
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Nano-Bio- Electronic, Photonic and MEMS Packaging

3.Nano-Bio- Electronic, Photonic and MEMS Packaging

作者:C. P. Wong (Ching-Ping)(EDI)  出版社:Springer Nature  出版日:2022/04/01 裝訂:平裝
缺貨無法訂購
Electrical Conductive Adhesives With Nanotechnologies

4.Electrical Conductive Adhesives With Nanotechnologies

作者:Yi Li; Daniel Lu; C. P. Wong  出版社:Springer Verlag  出版日:2009/09/11 裝訂:精裝
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Materials, Technology and Reliability for Advanced Interconnects 2005:VOLUME863
滿額折

5.Materials, Technology and Reliability for Advanced Interconnects 2005:VOLUME863

A spring 2005 meeting brought together leading modelers and experimentalists to examine process and reliability issues associated with depositing, characterizing, and integrating novel and existing ba
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)
Glycoscience ― Biology and Medicine

6.Glycoscience ― Biology and Medicine

作者:T. Endo (EDT); P. H. Seeberger (EDT); G. W. Hart (EDT); C. H. Wong (EDT); N. Taniguchi (EDT)  出版社:Springer Verlag  出版日:2014/05/29 裝訂:精裝
The aim of the book is to provide a succinct overview of the current status of glycoscience from both basic biological and medical points of view and to propose future directions, in order to facilita
若需訂購本書,請電洽客服
02-25006600[分機130、131]。

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