Microwave and Millimeter-wave Electronic Packaging

Electronic packaging is a subset of engineering concerned with the protection and reliability of electrical circuits. This is an overview of problems and challenges facing an engineer working with the components operating at microwave and millimeter-wave frequencies, some of which are unique to these frequencies. The book provides a general overview of electronic packaging techniques with a focus on applying them to these higher frequencies as well as an analysis of the design solutions unique to them. The scope of the problem is defined early in the book, with the discussion of undesired effects--resonances, parasitic and grounding concerns, distributed and thermal effects--that the good packaging design should alleviate. Specific discussion of materials used in packaging, different types of packaging (laminate, ceramic), solutions to heat transfer and interconnectivity issues and a look at future challenges follow. Several appendices detail physical data relevant to the questions of material choice and general design, including information on scattering and impedance parameters. Grounded in fundamental physics throughout, this is a useful text addressing a thorny--and often ignored or under-appreciated--problem. Annotation c2014 Book News, Inc., Portland, OR (booknews.com)