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無庫存,下單後進貨(採購期約45個工作天)
Fundamentals of Microsystems Packaging
  • Fundamentals of Microsystems Packaging

  • ISBN13:9781259861550
  • 出版社:McGraw-Hill
  • 作者:Rao Tummala
  • 裝訂:平裝
  • 版次:2
  • 出版日:2019/03/08
定  價:NT$7875元
優惠價: 957481
可得紅利積點:224 點

無庫存,下單後進貨(採購期約45個工作天)

商品簡介

作者簡介

A fully updated, comprehensive guide to electronic packaging technologies

This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems.

Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered.

• Covers the electrical, mechanical, chemical, and materials aspects of each technology
• Contains examples of all common configurations and technologies
• Written by the leading author in the field

Dr. Rao Tummala is a chair professor and director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of all three volumes of Microelectronics Packaging Handbook, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. Dr. Tummala was a longtime packaging technologist and IBM Fellow at IBM.

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