Over forty years of teaching experience are distilled into this text. The guiding principle is the wide use of the concept of intermediate asymptotics, which enables the natural introduction of the modeling of real bodies by continua. Beginning with a detailed explanation of the continuum approximation for the mathematical modeling of the motion and equilibrium of real bodies, the author continues with a general survey of the necessary methods and tools for analyzing models. Next, specific idealized approximations are presented, including ideal incompressible fluids, elastic bodies and Newtonian viscous fluids. The author not only presents general concepts but also devotes chapters to examining significant problems, including turbulence, wave-propagation, defects and cracks, fatigue and fracture. Each of these applications reveals essential information about the particular approximation. The author's tried and tested approach reveals insights that will be valued by every teacher and st
During a NATO Advanced Study Institute in Izmir, Tur- key, July 1973 on Modern Developments in Engineering Seis- mology and Earthquake Engineering it emerged that a debate on Continuum Mechanics Aspec
This Volume is the Proceedings of the IUTAM Symposium on Mesoscopic Dynamics of Fracture Process and Materials Strength, held at Osaka in 2003. It contains 41 papers by acknowledged experts covering i
This book examines "home front" literature of the Second World War, arguing that Gothic tropes and forms mark moments of fracture in the national mythologies of wartime home, city and fellowship. The
Proceedings of the April 1996 symposium. Eighty-some contributions are arranged in sections on mechanical properties of films and multilayers, fracture and adhesion, nanindentation of films and surfac
Covering strain relaxation and strengthening mechanisms, defects formation, mechanical properties and nanoscale testing, adhesion and fracture, thin film applications, computation modeling and experim
Novel measurement techniques, microstructural effects, reliability modelling, stress effects, advanced interconnect reliability, and adhesion and fracture are the concerns of the 49 papers. Invited pr
