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第四屆台灣電路板國際論壇2003
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ISBN13：9786629502071
替代書名：TPCA Forum 2003 Proceedings
出版社：台灣電路板協會
裝訂／頁數：平裝／238頁
規格：26cm*19cm (高/寬)
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高啟清：
The Challenges of AOI Inspection of IC Substrates and Fine-line PCB's.
X-ray Inspection for BGA/Filp Chip, CSP and SMT, Latest Developments.
How to Get Better Build-up Layer Exposure Alignment Accuracy.
Quantifying Performance of Mechanical and Chemical Processes for Pretreatment Prior to Solder Mask Application.
Stronger Drivers for Laser Direct Imaging.
江澤修：
Profitability-Management's Pitfall and Breakthrough During the Paradigm Shift.
High Performance Halogen-Free Laminate For IC Substrate.
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．
．
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The Challenges of AOI Inspection of IC Substrates and Fine-line PCB's.
X-ray Inspection for BGA/Filp Chip, CSP and SMT, Latest Developments.
How to Get Better Build-up Layer Exposure Alignment Accuracy.
Quantifying Performance of Mechanical and Chemical Processes for Pretreatment Prior to Solder Mask Application.
Stronger Drivers for Laser Direct Imaging.
江澤修：
Profitability-Management's Pitfall and Breakthrough During the Paradigm Shift.
High Performance Halogen-Free Laminate For IC Substrate.
．
．
．
．
今日66折
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