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第五屆台灣電路板國際論壇2004
商品資訊
ISBN13：9786629502088
替代書名：TPCA Forum 2004 Proceedings
出版社：台灣電路板協會
裝訂／頁數：平裝／404頁
規格：26cm*19cm (高/寬)
商品簡介
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商品簡介
潘金平：
Brightener Analysis of Acid Copper Plating Solution by Linear Sweep Voltammentry over Selecive Adsorption on Metal Electrode.
Novel Via Fill and Planarization Technology.
High Performance of Multilayer Bonding Treatment for Lead-Free PCB.
王開國：
The Study of High Dk PPE Laminate for Embedded Filters.
Ultra-Thin Substrate and Hi-Dk RCC for Use as Embedded Capacitors.
Embedded Capacitor with High Capacitance Density.
Compatibility between Embedded Passive and PCB：reliability, yield and process intergration.
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Brightener Analysis of Acid Copper Plating Solution by Linear Sweep Voltammentry over Selecive Adsorption on Metal Electrode.
Novel Via Fill and Planarization Technology.
High Performance of Multilayer Bonding Treatment for Lead-Free PCB.
王開國：
The Study of High Dk PPE Laminate for Embedded Filters.
Ultra-Thin Substrate and Hi-Dk RCC for Use as Embedded Capacitors.
Embedded Capacitor with High Capacitance Density.
Compatibility between Embedded Passive and PCB：reliability, yield and process intergration.
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