3d Ic Stacking Technology
商品資訊
ISBN13：9780071741958
出版社：McGraw-Hill Professional Pub
作者：Sesh Ramaswami
出版日：2011/09/09
裝訂：精裝
商品簡介
3D IC Stacking Technology is a comprehensive resource on three-dimensional stacking technology, including scientific theory, processing methods, applications, and an overview of the industry's technological future. The book is targeted to semiconductor engineers and portable device designers.
The quality and functional capabilities of nearly all of today’s electronic devices and the production lines that produce them are dependent on key internal semiconductor components—ICs. Lithography and packaging integration are the determining factors in keeping pace with the electronics industry’s quest to have more and more transistors on chip product by shrinking ICs and other related products, or by stacking the multiple chips into one chip device. This in-depth volume covers these cutting-edge technologies.
3D IC Stacking Technology
Comprehensive coverage:
Design challenges; Process sequence integration; TSV etch; Chemical vapor; Barrier/ seed deposition; ECD fill; Chemical mechanical polishing; Wafer thinning; Temporary and permanent bonding; Cost of ownership
作者簡介
Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards.
Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization.
Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.
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