Process for fabricating a porous film in a scattering layer: United States Patent

The present invention is directed towards a thin-film device. In one embodiment, the thin film device comprises a scattering layer comprising a substrate, the substrate comprising a plurality of voids, and a device stock formed atop the scattering layer, wherein the plurality of voids have a high refractive index as compared to a refractive index of the substrate. Another embodiment of the present invention is directed towards a process for fabricating a thin-film device, the process comprising dissolving a precursor in an organic solvent to form a solution, coating the solution onto a substrate to form a film, immersing the film and the substrate into an antisolvent bath for a first period of time so as to form a plurality of air voids within the film, removing the film and substrate from the anti-solvent bath to dry and cure for a second period of time to create a porous film adhered to the substrate, the porous film and the substrate forming a scattering layer.