Stephen O. Murray/ Will Roscoe/ Eric Allyn/ Louis Crompton/ Mildred Dickemann/ Badruddin Khan/ Hasan Mujtaba/ Nauman Nagvi/ Jim Wafer/ Sigrid Westphal-Hellbusch
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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the
The dramatic impact of Islamic fundamentalism in recent years has skewed our image of Islamic history and culture. Stereotypes depict Islamic societies as economically backward, hyper-patriarchal, and
