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Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.

One current challenge to micro- and nanoelectronics is the understanding of stress-related phenomena in metallization. Stresses arising in on-chip and 3D metal interconnects and in the surrounding mat

The proceedings of the title symposium, held in San Francisco in April 1993, comprise invited and contributed papers in the areas of dielectric reliability; microstructure effects on reliability; stre

Representing Symposium B at the April 2002 MRS Spring meeting, some 100 papers (roughly half of the total presented) address all facets of silicon processing except for junction formation, which was c

Papers presented at the MRS Symposium held in Boston, November 1990, in the areas of mechanical and deformation properties of polymer interfaces, protective coatings for ICs, measurement of material p

Proceedings of the symposium held April 27-30, 1992 in San Francisco, Calif., on polymers for multichip module packaging interconnects their system and technology, materials and processing, their ther