The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.
The amazing world of the mononuclear phagocytes keeps expanding at a truly awesome pace. As a result, maintaining currency with the latest developments and controversies that pertain to this cell type
This volume brings together the three most influential ancient Greek treatises on literature. Aristotle's Poetics contains his treatment of Greek tragedy: its history, nature, and conventions, with de
