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三民出版.新書搶先報|最速、最優惠的新鮮貨報給你知!

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原文書 (10)
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$800以上 (10)
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2024年 (1)
2020~2021 (3)
2018~2019 (1)
2016~2017 (1)
2016年以前 (4)
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平裝 (2)
精裝 (7)
有聲書 (1)
作者

,Josep,M. Garrofe (1)
Carlos Enrique Catalano Ph.D. (EDT) (1)
Garrof? Josep M. (EDT) (1)
Juan Cepeda-Rizo (1)
Juan Cepeda-Rizo,Jeremiah Gayle,Joshua Ravich (1)
Maarten P. de Boer (1)
Not Available (NA) (1)
Paul Jackson (1)
Richars Meza (1)
Wang Shaoqiang(EDI) (1)
出版社/品牌

CRC PR INC (1)
Consortium Book Sales & Dist (1)
Design Media Pub (1)
HOAKI BOOKS (1)
Kluwer Academic Print on Demand (1)
Laurence King UK (1)
Materials Research Society (1)
PBKTYFRL (1)
Promopress (1)
World Scientific Pub Co Inc (1)

三民網路書店 / 搜尋結果

10筆商品,1/1頁
Structural Packaging: GOLD
滿額折
作者:Josep; M. Garrofe  出版社:Promopress  出版日:2020/05/14 裝訂:精裝
Great package design has magic qualities. It grabs our attention with its genuine materials, shapes and colours and, even if we are sturdy enough to resist temptation, the brand - and the product - wi
無庫存,下單後進貨(到貨天數約45-60天)
定價:1924 元, 優惠價:9 1732
New Structural Packaging ― Gold Edition
滿額折
作者:Garrof? Josep M. (EDT)  出版社:Consortium Book Sales & Dist  出版日:2015/09/29 裝訂:有聲書
Great package design has magic qualities. It grabs our attention with its genuine materials, shapes and colours and, even if we are sturdy enough to resist temptation, the brand -and the product- will
無庫存,下單後進貨(到貨天數約30-45天)
定價:1710 元, 優惠價:1 1710
Wrap It Up: Creative Structural Packaging Design. Includes Diecut Patterns
滿額折
作者:Wang Shaoqiang(EDI)  出版社:HOAKI BOOKS  出版日:2021/07/06 裝訂:精裝
無庫存,下單後進貨(到貨天數約30-45天)
定價:2278 元, 優惠價:1 2278
作者:Not Available (NA)  出版社:World Scientific Pub Co Inc  出版日:2007/01/30 裝訂:精裝
Packaging is an essential aspect of retailing any manufactured product. Packages have traditionally served to protect and ship goods securely and inexpensively. This book teaches you how to design ine
無庫存,下單後進貨(到貨天數約30-45天)
定價:1745 元, 優惠價:1 1745
Structural Packaging ─ Design Your Own Boxes and 3-D Forms
滿額折
作者:Paul Jackson  出版社:Laurence King UK  出版日:2016/02/12 裝訂:平裝
Unlike other packaging titles, which simply provide templates to copy, this book enables designers of all packaging types to create 3-D packaging forms that are specific to their needs rather than bas
無庫存,下單後進貨(到貨天數約45-60天)
定價:1099 元, 優惠價:79 868
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
90折
作者:Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich  出版社:PBKTYFRL  出版日:2024/08/26 裝訂:平裝
無庫存,下單後進貨(到貨天數約45-60天)
定價:2989 元, 優惠價:9 2690
作者:Juan Cepeda-Rizo  出版社:CRC PR INC  出版日:2021/12/21 裝訂:精裝
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Corrugated Paper Packaging & Structure Design (with DVD)
滿額折
作者:Richars Meza  出版社:Design Media Pub  出版日:2018/12/01 裝訂:精裝
Corrugated Paper Packaging & Structural Design is a collection of design solutions. They are not only easy-to-carry packages; they are designed to be unconventional bags/boxes with impressive grap
無庫存,下單後進貨(到貨天數約30-45天)
定價:1125 元, 優惠價:1 1125
作者:Carlos Enrique Catalano Ph.D. (EDT)  出版社:Kluwer Academic Print on Demand  出版日:2005/06/01 裝訂:精裝
Viral Genome Packaging focuses on the process of genome "packaging" within a pre-formed viral procapsid. The chapters of this book concentrate on the biochemistry, enzymology and structural aspects of
若需訂購本書,請電洽客服
02-25006600[分機130、131]。
Materials Science of Microelectromechanical Systems (MEMS) Devices II:VOLUME605
90折
作者:Maarten P. de Boer  出版社:Materials Research Society  出版日:2000/10/02 裝訂:精裝
Microelectromechanical systems (MEMS) hold great promise for sensing and actuating on the micron scale. There is a hierarchy of increasing difficulty for placing MEMS devices in the field. Devices that do not allow contact between structural members rely mainly on mechanical properties of freestanding films. High-resolution techniques must be developed within the framework of MEMS to measure properties such as modulus and residual stress. When contact and rubbing contact are allowed, the complexities of adhesion and friction at the microscale must be understood and well controlled. Fluid interactions are similarly important for microfluidic devices. Packaging of MEMS for use in the field also requires special consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques. These approaches represent different but useful strategies to solve MEMS challenges, and must be integrated for product realizatio
無庫存,下單後進貨(到貨天數約45-60天)
定價:1819 元, 優惠價:9 1637

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